PG R-811 is an unmodified liquid epoxy resin with medium viscosity produced from bisphenol-A and epichlorohydrin. This is a standard liquid epoxy resin and a wide variety of curing agents are available to cure this liquid epoxy resin at ambient conditions and also at elevated temperature. When cured with appropriate hardener, PG R-811 gives excellent mechanical, chemical, electrical and adhesion properties. Because of these properties it finds use in various applications.
PG R-87 is an unmodified semi solid epoxy resin based on bisphenol A It can be suitable formulated in combination of other epoxy resins into high solids coatings and anti corrosive primers It is also used in adhesive formulations to increase flexibility It can be cured with aliphatic amines, polyamides, phenalkamines and cycloaliphatic amines and adducts.
PG R-89 is an unmodified, low viscosity liquid epoxy resin When it is used with appropriate epoxy hardeners, it provides excellent combination of performance properties including mechanical, thermal, chemical and physical.
PG R-8101 is an unmodified, medium viscosity, liquid epoxy resin based on Bisphenol-A. When it is used with an appropriate epoxy curing agent, it provides an excellent combination of mechanical, thermal, chemical and physical properties.
PG R-8101X75 is a 75 solution of solid epoxy resin (type 1 in xylene It can be cured with polyamidoamides, phenalkamines, amine adducts to formulate room temperature curing coating systems Comparatively long pot life, ease of application, excellent adhesion to concrete and metal surfaces are the key advantages of this resin.
PG R-8141 is an unmodified medium viscosity epoxy resin based on bisphenol-A. It is available in form of clear, transparent viscous liquid. It provides faster reactivity and short pot life in comparison of standard epoxy resin. It can be cured with polyamidoamide, cycloaliphatic amines, mercaptan, aliphatic amine and adducts. It provides an excellent adhesion to variety of substrates with strong durable bonds.
PG R-833 is a low viscous reactive diluent modified epoxy resin based on bisphenol A. due to low viscosity it is capable of high filler loading and excellent wetting property. It can be cured with various hardeners like polyamidoamide, phenalkamines, aliphatic amines, cycloaliphatic amines and adducts. The appropriately cured material is able to provide good combination of physical and mechanical properties.
PG R-8170 is a low viscous modified epoxy resin based on bisphenol A. due to low viscosity it is capable of high filler loading and excellent wetting property. It can be cured with various hardeners like polyamidoamide, phenalkamines, aliphatic amines, cycloaliphatic amines and adducts. The appropriately cured material is able to provide good combination of physical and mechanical properties.
PG R-8350 is a low viscous modified epoxy resin based on bisphenol A. due to low viscosity it is capable of high filler loading and excellent wetting property. It can be cured with various hardeners like polyamidoamide, phenalkamines, aliphatic amines, cycloaliphatic amines and adducts. The appropriately cured material is able to provide good combination of physical and mechanical properties.
PG R-847 is a low viscous reactive diluent modified epoxy resin based on bisphenol-A. Due to low viscosity it is capable of high filler loading and excellent wetting property. It can be cured with various hardeners like polyamidoamide, phenalkamines, aliphatic amines, cycloaliphatic amines, and adducts. The appropriately cured material is able to provide good combination physical and mechanical properties.
PG R-8118 is a low viscosity reactive diluent modified epoxy resin based on bisphenol-A. Due to low viscosity it is capable of high filler loading and gives excellent wetting property. It can be cured with various hardeners like polyamidoamide, phenalkamines, aliphatic amines, cycloaliphatic amines, and adducts. The appropriately cured material is able to provide good combination of physical and mechanical properties. It provides superior gloss when cured with cycloaliphatic amine adducts for floor toppings.
R-817 is a liquid, modified bisphenol-A based epoxy resin for electrical application.
PG R-8811 is a standard water reducible liquid epoxy resin which can be cured with a wide variety of curing agents at ambient conditions. When cured with appropriate hardener, PG R-8811 gives excellent mechanical, chemical, electrical and adhesion properties. Because of these properties it finds use in various applications. PG R-8811 can be reduced by water up to 30% to 40% W/W.